Samsung and Qualcomm Forge 2.1D Packaging Alliance

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Samsung and Qualcomm are reportedly developing organic-bridge 2.1D packaging for multi-die AI accelerators and other advanced chips.

Quick Report

Samsung and Qualcomm are reportedly forming a 2.1D packaging alliance based on organic bridges that connect multiple silicon dies. Unlike Intel's EMIB approach, which uses silicon bridges, the proposed design uses PCB-like organic polymer materials and copper wiring inside a flip-chip package.

The design is expected to use multiple redistribution layers, targeting line widths and spacing of 1.5 to 2 micrometers, via sizes of 4 to 5 micrometers, and die-to-die densities of 500 to 1,000 connections per millimeter. Samsung Foundry would manufacture the package, while Qualcomm is expected to use it for multi-die AI accelerators and other customers could adopt the technology as it matures.

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Source(s)

  • TPU