Micron Plans 400-Layer 3D NAND With Wafer-to-Wafer Bonding in 2027

storage Tag

2026

10-28

Micron Plans 400-Layer 3D NAND With Wafer-to-Wafer Bonding in 2027

10-16

FADU Debuts the File-Semantic SSD as a New Storage Pattern

10-13

Kioxia Adds Direct Liquid Cooling Support to Enterprise SSDs

10-06

YMTC Suggests the Memory Crunch Could Last Another Three Years

09-20

Chinese DRAM Maker CXMT Is Reportedly Preparing to Enter the NAND Flash Market

09-05

Lexar Shows Off MUSE Portable SSD, Claims World's Thinnest at IFA 2026

08-26

Samsung P9 and P7 Portable SSDs Bring USB4 to 8 TB

08-13

Kioxia and Sandisk Unveil 9th-Generation QLC 3D Flash Memory for AI Infrastructure

08-13

YMTC Surpasses Micron, Kioxia, and Sandisk in Global NAND Flash Market Share

08-11

DapuStor Pushes Bigger and Cooler SSDs for AI Storage