Micron Plans 400-Layer 3D NAND With Wafer-to-Wafer Bonding in 2027

micron Tag

2026

10-28

Micron Plans 400-Layer 3D NAND With Wafer-to-Wafer Bonding in 2027

10-02

Micron Expects Memory Supply Pressure to Intensify After 2026

09-23

Micron Signals the 2 GB GDDR7 Era Is Coming to an End

08-05

Samsung Maintains DRAM Market Share Lead as Micron Continues to Catch Up

08-04

Microchip and Micron Showcase a High-Performance PCIe Gen 6 Storage Architecture

07-01

DRAM Triarchy Faces Class-Action Lawsuit for Price-Fixing and Cartel Behavior

06-28

Micron Predicts DRAM Crisis Until at Least 2028

05-06

Micron Begins Shipping 245 TB 6600 ION Data Center SSD

03-05

DRAM Market Tightens as Suppliers Move to Hourly Price Contracts

02-25

Micron Reveals 24 Gbit GDDR7 Memory With 36 Gbps Bandwidth