Longsys Announces Industry's First Integrated-Packaging mSSD
Longsys debuts chip-level micro SSD using System-in-Package tech, eliminating PCBs and solder joints while delivering PCIe Gen 4 speeds in compact 20×30mm form.
Longsys debuts chip-level micro SSD using System-in-Package tech, eliminating PCBs and solder joints while delivering PCIe Gen 4 speeds in compact 20×30mm form.
Foxconn starts validation for NVIDIA's Vera Rubin NVL144 racks with 144 GPUs and HBM4 memory, doubling compute density for late 2026 volume production.
In Win unveils SHIFT, a CNC-machined aluminum open-frame chassis supporting E-ATX motherboards with tool-less GPU mounting and integrated cable management.
Cornell validates GSI's compute-in-memory APU matches GPU AI performance with 98% lower energy consumption, potentially disrupting the $100B inference market.
Microsoft confirms Windows 11 25H2 October update KB5066835 breaks mouse and keyboard in WinRE, rendering recovery tools completely unusable until patched.