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Intel just announced their next Lunar Lake CPU at Computex 2024. Based on aggregated compute tiles aka chiplet design for processing, Input/Design, Graphics and Memory on Processor design, thus calling it as an SiP (System in Package) or SoC (System on Chip) designs similar to Apple Silicon. It's built on Intel 4 node, GPU IP (Xe2 aka BattleMage) on TSMC's 5nm and TSMC's 6nm IO die all bonded to a 20nm base tile to facilitate high density microscopic wires connecting all the tiles.

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