Intel Demos Packaging for 16 Compute Dies and 24 HBM5 Modules
Intel demos packaging for up to 16 compute dies and 24 HBM5 modules, using Foveros 3D, EMIB-T, and 18A/14A nodes for AI and HPC.
Intel's Fab 52 Surpasses TSMC Arizona in Size and Output
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Intel's Fab 52 produces over 40,000 wafers/month on 18A node, surpassing TSMC Arizona in size and tech, with ongoing yield improvements.
Arch Linux Ends Official Support for NVIDIA Pascal and Older GPUs
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Arch Linux drops support for NVIDIA Pascal and older GPUs with the 590 driver, forcing users to use community drivers.
System Integrators Now Sell No-RAM PCs as Memory Prices Surge
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Due to DRAM shortages and high DDR5 prices, PC builders offer prebuilt systems without RAM, putting compatibility risks on buyers.
AMD Zen 6 3D V-Cache CPUs to Feature Up to 288 MB Cache
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AMD's Zen 6 CPUs may feature up to 288 MB of 3D V-Cache, using TSMC's 2 nm and 3 nm nodes with new AVX-512 extensions for better performance.