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Insights and Trends in Technology

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Intel has announced it will drop support for 16x MSAA (Multi-Sample Anti-Aliasing) with its upcoming Xe3 Celestial graphics architecture. While the architecture will continue to support MSAA at 2x, 4x, and 8x levels, the company cites modern upscaling technologies like XeSS and TAA as superior alternatives that make the legacy 16x MSAA obsolete for most use cases.

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Intel has secured a significant win by landing Tesla's Dojo 3 packaging contract, signaling a new dual-supplier approach where Samsung Electronics Foundry will manufacture the custom D3 AI-training chips while Intel handles the packaging and testing. This partnership leverages Intel's Embedded Multi-Die Interconnect Bridge (EMIB) technology to connect multiple dies through silicon bridges rather than a full-wafer interposer.

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Apple's China support account accidentally posted a promotional trailer for Samsung's Galaxy Z Flip 7 on Weibo, creating an embarrassing marketing mishap amid the company's own foldable iPhone development efforts.

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AMD has announced it now holds the title of world's fastest across nearly all processor form factors, from supercomputers and servers to desktop gaming and AI PCs, marking a significant milestone in the company's competitive positioning against Intel.

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