CXMT Reportedly Struggles With HBM3E, Yields Are Only 25%

Quick Report

Chinese memory maker CXMT is reportedly struggling with HBM3E production, with usable yields said to be only about 25%. The reported figure highlights how difficult it is to manufacture advanced high-bandwidth memory at scale, particularly as AI accelerator demand puts pressure on the supply chain.

Low yields would make each usable stack more expensive and could limit CXMT's ability to compete with established HBM suppliers. HBM production combines advanced DRAM dies, stacking, bonding, testing, and packaging, so improving yield is essential before large-volume shipments become practical. The report remains unconfirmed, but it illustrates the manufacturing gap new suppliers must close.

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Source(s)

  • TPU