Rapidus Targets Eight-Reticle Interposers on 600 Mm Advanced Packaging Panels by 2030

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Rapidus is targeting advanced packaging panels measuring 600 mm with eight-reticle interposers by 2030.

Quick Report

Rapidus is targeting production of eight-reticle interposers on 600 mm advanced packaging panels by 2030, outlining an ambitious roadmap for large-scale semiconductor packaging.

Larger panels could improve packaging throughput and support increasingly complex chiplet-based designs. Reaching the target will require progress in panel processing, alignment, yield, and the broader manufacturing ecosystem that supports advanced interposers.

Source(s)

  • TPU