TSMC Achieves 98 Percent Yield on CoWoS-L Packaging

Posted on
TSMC reportedly achieved a 98 percent yield on its CoWoS-L packaging process while preparing larger reticle-scale designs for future production.

Quick Report

TSMC has reportedly achieved a 98 percent yield on its CoWoS-L advanced packaging process using a 5.5-times reticle-size design. The result is significant for AI accelerators, which increasingly combine large compute dies and high-bandwidth memory in a single package.

TSMC is also looking toward 1.4-times designs in 2029, pointing to a continued expansion of package size and integration. Higher yields can improve manufacturing economics, but scaling these packages will still require precise assembly, thermal management, and reliable interconnects.

Source(s)

  • TPU