SK Hynix Launches iHBM Design With Integrated Cooling for AI Memory
Quick Report
SK hynix announced iHBM, a new high-bandwidth memory packaging approach that embeds integrated cooling elements directly inside the package for next-generation AI memory products. The company positions this as a structural redesign for heat handling as stack heights and transfer speeds continue rising.
Instead of relying only on indirect heat flow through the core die, iHBM places cooling structures in the D2D PHY region where thermal concentration is highest between HBM and GPU interfaces. SK hynix says this added dissipation path reduces thermal resistance by about 30% and improves stability under high-temperature, high-pressure operating conditions.
If validated at volume, iHBM could become a key differentiator for HBM suppliers as data-center AI accelerators push toward denser stacks and tighter power envelopes.
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