Intel and Amkor Team Up to Scale EMIB Packaging Production

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Intel and Amkor partner to scale EMIB packaging production, expanding advanced chip packaging capabilities to meet high-performance computing demand.

Quick Report

Intel and Amkor Technology have announced a partnership to scale production of EMIB (Embedded Multi-die Interconnect Bridge) packaging technology. This collaboration aims to expand advanced packaging capabilities and meet the rising demand for high-performance computing solutions.

EMIB is Intel's proprietary chiplet interconnect technology that enables high-bandwidth connections between dies while maintaining compact form factors. By partnering with Amkor, a leading packaging and test services provider, Intel can accelerate production capacity and bring EMIB technology to a broader range of customers. This move strengthens Intel's position in advanced packaging, a critical competitive advantage in modern semiconductor manufacturing.

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Source(s)

  • TPU