Intel Wins Tesla Dojo Contract in Dual Supplier Strategy With Samsung Foundry

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Quick Report

Intel has secured a significant win by landing Tesla's Dojo 3 packaging contract, signaling a new dual-supplier approach where Samsung Electronics Foundry will manufacture the custom D3 AI-training chips while Intel handles the packaging and testing. This partnership leverages Intel's Embedded Multi-Die Interconnect Bridge (EMIB) technology to connect multiple dies through silicon bridges rather than a full-wafer interposer.

  • Tesla has chosen a dual-vendor approach for its Dojo 3 AI supercomputer, splitting responsibilities between Samsung and Intel
  • Samsung will manufacture the next-generation AI6 chips on a 2nm process
  • Intel will handle packaging using its EMIB technology
  • This marks a departure from Tesla's previous reliance on TSMC for both fabrication and System-on-Chip packaging
  • The partnership addresses capacity constraints at TSMC for its Chip-on-Wafer-on-Substrate (CoWoS) services

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Source(s)

TPU