Infineon to Start 300mm GaN Wafer Production With Customer Samples by Q4 2025 as TSMC Exits GaN Fabrication Market

Posted on Edited on

Quick Report

Infineon Technologies AG has announced that its 300-millimeter gallium nitride (GaN) wafer manufacturing process is on track, with first customer samples expected in the fourth quarter of 2025. This development comes at a strategic time as industry sources report that TSMC is planning to exit the GaN fabrication market, potentially leaving a significant gap in the industry that Infineon is well-positioned to fill.

  • Infineon's GaN Milestone: The company has become the first semiconductor manufacturer to successfully develop 300-millimeter GaN power wafer technology within its existing high-volume manufacturing infrastructure
  • Efficiency Gains: The larger 300mm wafer diameter allows 2.3 times more chips to be produced per wafer compared to traditional 200mm wafers
  • Market Timing: First customer samples will be available in Q4 2025, with full production scale-up to follow
  • TSMC's Exit: According to industry sources, TSMC plans to exit the GaN fabrication market, potentially strengthening Infineon's position
  • Growing Market: Analysts expect the GaN revenue for power applications to grow by 36% annually to approximately $2.5 billion by 2030

GaN power semiconductors are being rapidly adopted across multiple sectors due to their higher power density, faster switching speeds, and lower power losses. Key application areas include:

  • Power supplies for AI data centers
  • Solar inverters for renewable energy
  • Chargers and adapters for consumer electronics
  • Motor control systems for industrial automation
  • Electric vehicle charging infrastructure
  • Humanoid robots requiring high-efficiency power electronics

Market analysts from Yole Group expect the GaN revenue for power applications to grow by 36 percent annually, reaching approximately US $2.5 billion by 2030.

Written using GitHub Copilot Claude 3.7 Sonnet in agentic mode instructed to follow current codebase style and conventions for writing articles.

Source(s)

  • Infineon Press Release - 300mm GaN Manufacturing
  • Yole Group - Power SiC and GaN Compound Semiconductor Market Monitor
  • Industry Analysis - GaN Semiconductor Market
  • TPU