Eliyan Corp Delivers Highest Performing Chiplet PHY at 64Gbps in 3nm Process

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Quick Report

Eliyan corp credited for the invention of semiconductor industry’s highest performing and most power efficient chiplet PHY at 64Gbps in 3nm process named NuLink 2.0 PHY. The device achieved 64Gbps/bump the highest performing die-to-die PHY solution for multi-die architectures. It’s compatible with UCIe standard with 2x bandwidth on standard as well as advanced packaging.

NuLink 2.0 supports Universal Memory Interconnect (UMI), a chiplet interconnect technology improving die to memory bandwidth efficiency by 2x. UMI also leverages bi-directional PHY which is currently in draft stage and will be finalized Open Compute Project (OCP) BoW 2.1.

You can read more about NuLink 2.0 PHY here.

Source(s)

  • TPU
  • NuLink 2.0